<![CDATA[
Hi-Rel labs, leader in Destructive Physical Analysis (DPA), Failure Analysis (FA), and Materials Analysis. Microelectronic testing for the Aerospace Industry. We can SEM, Cross-Section, Dot map, Line-scan, photograph, electrical, p.i.n.d, radiography, hermeticity, visual inspection, bond pull, die shear, connector testing, etc. to your needs.
]]>