Destructive Physical Analysis Seminar

Service Description

This course is a comprehensive 5-day lecture and lab combination presented for the purpose of training DPA Engineers, Technicians, and Component Engineers in the history / background, physics, methodology, and techniques involved in the performance of DPA Testing or Review Processes. The class will cover all part types widely used in current Space programs: Microcircuits, Hybrids, Transistors, Diodes, Capacitors, Resistors, Connectors, Magnetics, Crystals, Relays, and Fuses. The tests to be covered will be: External Visual Inspection, External Prohibited Materials Analysis (PMA), Hermeticity Testing, Real Time Radiography, Solderability Testing, PIND, IGA (RGA), Terminal Strength Testing, Delidding or Decapsulation Techniques, Internal Visual Inspection, Cross Sectioning, Internal PMA Testing, Bond Pull Testing, Glassivation Removal for SEM Metallization Inspection, SEM Metallization Step Coverage Inspection, and Die Shear Testing. Students will leave the course with a working knowledge of MIL-STD-1580, as well as the MIL-STD-883, 750 and 202 Tests that apply to DPA. 5 student minimum.